| 工艺关键制程能力 |
2026-HVM |
2027-HVM |
2028-HVM |
| 最小SMD尺寸 |
008004 |
008004 |
008004 |
| 最小BGA球间距 |
0.15mm |
0.15mm |
0.15mm |
| 最小BG厚度 |
100μm |
75μm |
50μm |
| BG公差 |
10μm |
7μm |
5μm |
| FC凸点间距 |
≥80 μm |
≥80μm |
≥80μm |
| FC芯片尺寸 |
0.5*0.5≤Size≤32*25mm |
0.5*0.5≤Size≤32*25mm |
0.5*0.5≤Size≤32*25mm |
| DA芯片厚度 |
≥75μm |
≥50μm |
≥50μm |
| DA芯片尺寸 |
0.15*0.15≤Size≤30*30mm |
0.15*0.15≤Size≤50*50mm |
0.15*0.15≤Size≤50*50mm |
| WIRE类型 |
Au /Au-Ag Alloy/Cu/AI Wire/Al Ribbon |
Au /Au-Ag Alloy/Cu/AI Wire/Al Ribbon |
Au /Au-Ag Alloy/Cu/AL Wire/Al Ribbon |
| WIRE尺寸 |
0.6-2.0mil |
0.6-2.0mil |
0.6-2.0mil |
| BPP/BPO |
40/36μm |
40/36μm |
40/36μm |
| 包封方式 |
CoB/CUF/MUF/E-MUF/Double-sided |
| 塑封厚度 |
0.35/0.4/0.45/0.54/0.6/0.68/0.7/0.8/1.2/1.5/2.5/4.0/5.5 mm |
| 植球尺寸 |
P0.35mm/B 0.2 mm |
P0.35mm/B0.2 mm |
P0.35mm/ B 0.2mm |
| FCBGA最大尺寸 |
75mm*75mm |
110mm*110mm |
110mm*110mm |
