先进封装与系统集成解决方案
FOPLP工艺流程
| Item | 2026 | 2027 | 2028 | 2029 | |
|---|---|---|---|---|---|
| 固晶 | 面板尺寸 | 508*203mm | 508*406mm | 508*406mm | 508*406mm |
| 固晶精度 | 偏移＜±15μm，转角＜0.5° | 偏移＜±15μm，转角＜0.5° | 偏移＜±10μm，转角＜0.3° | 偏移＜±10μm，转角＜0.3° | |
| 芯片尺寸 | ＜5*5mm | ＜7*7mm | ＜10*10mm | ＜10*10mm | |
| 芯片镀层 | NiAu,Cu,Ag | NiAu,Cu,Ag | NiAu,Cu,Ag | NiAu,Cu,Ag | |
| 芯片厚度 | ≤0.1mm | ≤0.075mm | ≤0.075mm | ≤0.05mm | |
| BPO/BPP | 0.25*0.25mm/0.3mm | 0.2*0.2mm/0.3mm | 0.2*0.2mm/0.25mm | 0.15*0.15mm/0.2mm | |
| Molding | 厚度极差 | 15μm | 15μm | 10μm | 5μm |
| 厚度 | 0.2mm | 0.3mm | 0.4mm | 0.4mm | |
| 激光钻 | 孔径/精度 | 50μm/±25μm | 50μm/±25μm | 40μm/±20μm | 40μm/±20μm |
| 线路能力 | LW/LS | 50um/50μm | 35um/35μm | 30um/30μm | 20um/20μm |