集成电路测试解决方案
SCI
| 类型 | 测试设备制造商 | 机台型号 |
|---|---|---|
| CP/FT | Advantest | T2000/V93K Series WPI 、Load Board 、Probe Card |
| T5830 Probe Card | ||
| Teradyne | J750/J750HD/EX Load Board、Probe Card | |
| Catalyst | ||
| IFLEX/UFLEX | ||
| LTX-CREDENCE | M2 Probe Card | |
| D10/DX | ||
| NCATEST | NTS1625/NTS1625L WPB 、Probe Card | |
| K8000 Load Board 、Probe Card | ||
| Chroma | 3360/3380 | |
| Burn-in | JEC | P6502 |
| DI | AF8652、AF8862、DL600、DL601、DL601H2M | |
| DL601HV16、DL602、DL612H2M | ||
| STK | SBS22010 | |
| SSE | B1120M | |
| MCC | HPB5C、LC2 | |
| ADVANTEST | B6700 |
| 项目 | 标准能力 | 研发能力 | ||
|---|---|---|---|---|
| PCB | BGA节距 | 0.4mm | 0.35mm | |
| 最小钻孔 | 0.13mm | 0.10mm | ||
| 厚径比 | 33 | 40 | ||
| 层数 | 2~70L | 120L | ||
| 板厚 | 8mm（320mil） | 10mm（400mil） | ||
| 翘曲公差 | Load Board | 0.4% | 0.3% | |
| Probe Card | 0.3% | 0.2% | ||
| 阻抗公差 | Inner Layer | +/-7% | +/-5% | |
| Outer Layer | +/-10% | +/-7% | ||
| LB/PC PCB材料 | HighTg FR4 | EM827, 370HR, S1000-2, IT180A, T158, TU862HF | ||
| High Speed | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000 | |||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835 | |||
| BIB PCB材料 | Polyimide（135 to 180°C) | Arlon 85N/33N, ShengYi SH260 | ||
| High Tg FR4(up to 135°C) | EM827, S1000-2, IT180A, 370HR | |||
| 组装 | 贴片最大尺寸 | 610*610mm | 610*1068mm | |
| 最大板厚 | 6mm | 8mm | ||
| 元件贴装尺寸 | 0.4*0.2–74*74mm | 0.2*0.1–74*74mm | ||
| 压接最大 尺寸 | 600*900mm | 700*1200mm | ||
| 通孔焊接最小BGA节距/孔径 | 0.5mm/0.2mm | 0.4mm/0.2mm | ||
| 产品类型 | DDR DIB |
|---|---|
| 应用场景 | DRAM老化测试 |
| 板卡尺寸 | 570*440mm |
| 层数 | 16 L |
| 最高工作温度 | 125 °C |
| Socket插座节距 | 0.8mm |
| Socket数量/板 | 384 |
| 产品类型 | NAND BIB |
|---|---|
| 应用场景 | Flash老化测试 |
| 板卡尺寸 | 570*440mm |
| 板厚 | 1.6mm |
| 最高工作温度 | 125 °C |
| Socket插座节距 | 0.5mm |
| Socket数量/板 | 320 |