集成电路测试解决方案

类型 测试设备制造商 机台型号
CP/FT Advantest T2000/V93K Series WPI、Load Board、Probe Card
T5830/T5833/T6391 Probe Card,T6575/T5830ES/T5833ES Load Board
Teradyne J750/J750HD/EX Load Board、Probe Card
Catalyst
IFLEX/UFLEX Load Board、Probe Card,M2 Probe Card
Chroma 3360/3380P Load Board、Probe Card
NCATEST NTS1625/NTS1625L WPB、Load Board、Probe Card,K8000 Load Board、Probe Card
AccoTEST STS8200/STS8300 Load Board、Probe Card
Other SandTek S100/S200,TBTest T800,MacroTest OS2000/MS8000 Load Board、Probe Card
Burn-in JEC P6502
DI AF8652、AF8862、DL600、DL601、DL601H2M、DL601HV16、DL602、DL612H2M
STK SBS22010
SSE B1120M
MCC HPB5C、LC2
ADVANTEST B6700
Other UniTest N201,StarTest ST-805
项目 标准能力 研发能力
组装 贴片最大尺寸 610*850mm 610*1068mm
最大板厚 8mm 10mm
元件贴装尺寸 0.4*0.2–74*74mm 0.2*0.1–74*74mm
压接最大尺寸 600*900mm 700*1200mm
通孔焊接最小BGA节距/孔径 0.5mm/0.2mm 0.4mm/0.15mm
板卡 B G A 节 距 0.35mm 0.30mm
最小钻孔 0.13mm 0.10mm
厚径比 33 40
层数 120L 130L
板厚 10mm(400mil) 12mm(480mil)
ATE PCB材 料 High-Tg FR4 EM827,370HR,S1000-2,IT180A,T158,TU862HF
High Speed M4,M6,M7,TU872SLK,FR408HR,N4000-13 Series
High Frequency Ro3003,Ro3006,Ro4350B,Ro4360G2,Ro4835
BIB PCB材料 Polyimide(135 to 180℃) 85N/33N,SH260,VT901
High-Tg FR4(up to 125℃) EM827,S1000-2,IT180A